eID document producer Smart Packaging Solutions‘ new release promises smart card manufacturers significantly better yield rates due to an improved manufacturing process.
Hybrid 8 is a new micro module for hybrid cards with both contact and contactless chips and has the exact same dimensions as their Dual 8 module used for dual interface cards which support contact and contactless communication with a single chip. The development allows smart card manufacturers to integrate both the contact and contactless chip at the end of the process, thereby producing a better yield than the usual process where the chip has to be included before lamination and printing. This also leads to a shorter supply chain.
The Hybrid 8 micro module is also compatible with the company’s exclusive security features.